Description

As data centers adopt liquid cooling, fitting in new cooling distribution infrastructure can be a real challenge. From hyperscale and colocation environments to edge applications, the Vertiv™ Liebert® XDU simplifies your work with the flexibility to support rear door heat exchangers or direct contact liquid cooling. The Liebert® XDU’s compact footprint allows for end of row or perimeter placement. However, and wherever you incorporate the Liebert XDU, you can easily distribute coolant to efficiently manage power-dense hot spots liquid to liquid up to 450 kW or 1,368 KW. Compact footprint for deployment flexibility within the row or perimeter; Efficient Cooling Distribution to manage power-dense hot spots and up to 450 kW or 1,368 kW; Precise Temperature Control to eliminate thermal shock for server CPU and GPUs; Redundant Pumps and Dual Power Feeds for optimizing reliable operation; Remote Monitoring available through communications with HTTP, SNMP, RS-485 Modbus, Modbus IP.